🏫Education
- 🎓National University of Singapore, Singapore
- 🎓Fudan University, Shanghai, China
- 🎓Jilin University, Changchun, China
💼Professional Experience
- 👨🏻💻National University of Singapore
- Research Fellow, Incoming
- School of Computing
- 👨🏻💻AMD Singapore (Former Xilinx Asia Pacific)
👨🏻🏫Teaching Experience
- Teaching assistant, CEG5202 Embedded Software Systems and Security, Spring 2023 and Spring 2024, NUS
- Teaching assistant, CEG5201 Hardware Technologies, Principles, & Platforms, Fall 2023, NUS
- Teaching assistant, TIE2030 Programming Methodology with Python, Fall 2022 and Fall 2023, NUS
- Teaching assistant, TEE2101 Programming Methodology, Spring 2023 and Spring 2024, NUS
- Teaching assistant, Internet of Things (IoT) Systems and Engineering, Fall 2020, Fudan Univ.
🤝Academic Service
- Reviewer, 2024-Present, IEEE Transactions on Circuits and Systems I: Regular Papers
- Reviewer, 2024-Present, IEEE Transactions on Very Large Scale Integration Systems
- Reviewer, 2025-Present, IEEE Journal on Emerging and Selected Topics in Circuits and Systems
- Reviewer, AICAS’2026: International Symposium on Artificial Intelligence Circuits and Systems
- Reviewer, ISCAS’2025: International Symposium on Circuits and Systems
- Reviewer, ISCAS’2024: International Symposium on Circuits and Systems
- Reviewer, ICCAD’2024: ACM/IEEE International Conference on Computer-Aided Design
- Reviewer, ICONS’2023: International Conference on Neuromorphic Systems
- Reviewer, SOCC’2021: 34th IEEE International System-on-Chip Conference
🎖️Awards
- Student Travel Grant, IEEE CASS, 2025
- NUS Research Scholarship, National University of Singapore, 2022
- Micron Foundation Prize, 2022
- Second-Class Scholarship, Fudan University, 2020
- First-Class Scholarship, Fudan University, 2019
- Oustanding Graduate Award, Jilin University, 2019
- Samsung Scholarship, 2017
- First-Class Scholarship, Jilin University, 2016, 2017, 2018, 2019
🗨️Invited Talks
- “Hardware-Software Co-Design for Memory-Centric Architectures in AI Era,” Hunan University, China, 2025.
- “Hardware-Software Co-Design for Memory-Centric Architectures in AI Era,” Hefei University of Technology, China, 2025.
- “Chip Industry Technical Paper Roundup: Nov. 18,” Semiconductor Engineering Link
- “Silicon Photonic Interconnected Chiplets with Computational Network and IMC for LLM Inference Acceleration,” Semiconductor Engineering Link
- “PICNIC: Silicon Photonic Interconnected Chiplets with Computational Network and In-memory Computing for LLM Inference Acceleration,” Chiplet Marketplace Link